As our name suggests, our emphasis is upon integration of highly miniaturized components, such
as miniature IC's, passives, MEMS devices, opto-electronic elements, or microfluidic features into working systems that
occupy volumes comparable to a sugar cube. This requires working with a wide variety of materials to fabricate features
dimensions that may range between 5 microns and 1 millimeter.
Our interconnect
circuitry utilizes embedded conductors fabricated by an additive technology.
Features such as conductive links, pads, and vias are defined with maskless, computer controlled processes that are interfaced
to CAD files. This CAD/CAM additive approach to manufacturing allows fast design changes and is easily adaptable to
small batch production, while remaining cost effective in high-volume applications.
Processes
that define conductor geometries, via dimensions, and substrate shapes are laser-based, which provides a capability for extreme
miniaturization and dramatic flexibility of form factor.
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We also can provide other supporting operations needed for mesoscale
integration- Vacuum lamination of thin sheets and films Precision dispensing of epoxies and solder pastes Placement of miniature components with high accuracy
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