Stacking of embedded component modules
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| Two stacked, interconnected modules with components attached to the top surface. |
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Embedded component modules can be stacked to form 3D assemblies with high component density. Interconnection
is accomplished with vias that extend entirely through each module. Modules can be stacked to form complete mesoscale
systems such as wireless sensing nodes.
A whitepaper describing Embedded Component 3D Packaging is available
on the Publications page.
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