A new approach to enabling the miniaturization of sensor node infrastructure (communication,
signal processing, power and packaging) will be described by Dr. Paul Christensen at Sensors Expo to be held in Rosemont,
IL June 7-10, 2011. In a presentation titled " Providing the Infrastructure for Connecting to the World - One Sensor
at a Time" use of fine-feature nanoparticle silver conductors and embedding of surface mount packaged components will
be shown to allow high component packing density and significant size reduction of sensor nodes. Dr Christensen will
describe how this technology is providing the infrastructure needed to support a single sensor (power supply, signal
processing, communication, and packaging) and deliver its output to the external world.