We have developed a process that combines the benefits  of fine feature embedded conductors with the many advantages of embedded component packaging.   Using the process sequence shown at the right, we achieve high component packing density in mechanically and environmentally robust assemblies.

Fabrication begins with filling of a laser-etched pattern on the front and back sides of a thin substrate with a nanoparticle silver paste.  The resulting conductor configuration is covered by a photopatterned coverlay material similar to a conventional soldermask.  Surface mount components are attached using conductive epoxy and the assembly is encapsulated with a thermally conductive polymer similar to that used in integrated circuit packaging.  After curing, the encapsulated assembly is inverted, coverlay is applied to the backside and patterned to allow access to conductors or attachment of a second layer of components.