Use of nanoparticle conductors and embedded components to be discussed at IMAPS Device Packaging 2011 Conference, March 8-9, 2011.

In a presentation titled “Miniature MEMS Interface Circuits using Nanoparticle Conductors and Embedded Components” Paul Christensen will describe applications of Potomac MesoSystems’  packaging technology to interfacing MEMS components to the external world. 

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Potomac MesoSystems, LLC * 231 Hidden Valley Road * Tracys Landing, MD * USA * 20779 * Phone: (240) 375-7480