Use of narrow, embedded conductors fabricated with nanoparticle
silver pastes allows us to easily route traces between pads and fabricate the entire interconnect structure on a minimal number
of layers. In turn, this reduces fabrication cost
and enhances yield and reliability. The laser patterning process also allows a high degree of control
over width and thickness of conductors and enhances substrate adhesion, which is further assured by the solder mask cover
layer.
Green, lead-free fabrication
There is no use of metal plating or etching processes or aggressive development
chemicals in any fabrication step. Consequently fabrication is ecologically friendly and avoids the costs associated
with waste stream treatment.
Compatible with rapid prototyping and small batch fabrication
All substrate fabrication steps can be defined by a single CAD drawing, and no masks are required. This CAD-to-Fab capability allows rapid design changes for fast product development and is amenable to small batch
production. In high-volume production, parallel processing concepts provide competitive processing
costs.
A whitepaper describing fabrication of Single and Double Layer Circuits with Embedded Nanoparticle
Conductors is available on the Publications page.
